News & Market Insights

The new AI-generated animated ultrasonic line-integration solution combines vision guidance and intelligent path optimization to deliver higher yield and faster ramp-up times.

As advanced semiconductor packaging (CoWoS), high-end chip packaging, and next-generation consumer electronics demand improved thermal management and insulation, the use of high-thermal-conductivity materials and high-viscosity adhesives (e.g., highly filled non-conductive adhesives, thermal pastes) has become widespread. However, traditional dispensing equipment faces technical bottlenecks when handling these high-viscosity fluids, such as excessive shear, incomplete breakoff, and inconsistent dispense volumes.

RASEM's R&D team spent two years tackling this core challenge and successfully integratedUltra-high-speed non-contact piezo impact technology (Piezo Jetting)with a newly developed fluid-heating dynamic compensation module. The system can maintain precise high-accuracy dispensing and high-speed precision spray coating even during high-velocity motion.

Test data shows that whether performing narrow-bezel precision filling in a 0.15 mm micro-gap or applying uniform moisture-resistant coating on irregular surfaces, the new system can keep dispense volume error within an extreme ±1%. The deployment of this automated fluid-control integrated solution will greatly help semiconductor packaging customers and 3D packaging process lines upgrade to smart manufacturing.